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Promax Mid-layer General-purpose Tin Planting Platform For iPhone 13 Series (YCS)

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SKU 107182117254

$11.18

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Tin mesh designed for precise reballing of iPhone 13 Pro Max logic board solder pads
Restores damaged or missing pad structures during multilayer and IC-level repair
Ensures accurate alignment and uniform solder distribution across reworked sections
Ideal for CPU, PMIC and mid-layer component reballing on the iPhone 13 Pro Max
High-temperature resistant mesh suitable for professional microsoldering tasks
YCS mesh engineered for consistency, accuracy and durability in board-level rework