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SLD01 Strong Magnetic Chip Positioning Tin Pad (YCS)

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SKU 107182117213

$2.84

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Strong magnetic base securely holds IC chips, stencils and small components in place during reballing and tinning
Designed for precise chip positioning to improve accuracy and consistency in microsoldering work
Ideal for BGA ICs and other small packages used in mobile phone, tablet and motherboard repair
Flat work surface helps keep solder paste and tin distribution even across chip pads
Reusable and durable construction suitable for daily use in professional repair labs
YCS SLD01 model compatible with a wide range of common reballing and chip repair setups