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Mid-layer General-purpose Tin Planting Platform For iPhone 17 Series (YCS)

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SKU 107182117260

$9.76

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Mid-layer solder mesh designed for accurate reballing of iPhone 17, 17 Pro and 17 Pro Max multilayer boards
Ensures precise restoration of solder points across middle layers during board-level repair
Improves alignment and consistency when rebuilding damaged or missing solder pads
Ideal for CPU, PMIC and multilayer IC repair on iPhone 17 series logic boards
High-temperature resistant mesh compatible with professional microsoldering workflows
YCS mesh optimized for reliability and accuracy in advanced logic board rework